Warren Adhesives 611 MC Mini Chip Bulk Packaging Hot Melt Adhesive

Warren Adhesives 611-MC Mini Chip Hot Melt for Packaging Applications

Warren Adhesives 611-MC is a fast-tack, packaging-grade hot melt designed to deliver strong fiber tear bonds on cardboard, corrugated, and coated stocks. The mini chip format allows for quick melting and smooth dispensing in standard bulk hot melt equipment—ideal for automated packaging lines and high-volume applications. It offers consistent machinability, low stringing, and excellent pot stability for clean, efficient performance.

Performance Benefits of 611-MC Mini Slat Case and Carton Adhesive

• Mini Chip Format: Melts quickly and handles easily in standard hot melt tanks.
  
• Strong Fiber Tear Bonds: Delivers high-strength adhesion to corrugated and coated surfaces.
  
• Good Machinability: Runs smoothly in most bulk dispensing systems with minimal stringing.
  
• Standard Temperature Formula: No need for high-temp equipment—works with traditional setups.
  
• Clean Cutoff: Low stringing ensures less mess and more uptime.
  
• Excellent Pot Stability: Maintains adhesive quality during extended run times.

Specifications

• Series: 611 MC (Mini Chips)
  
• Applications: Cardboard, Corrugated, Coated Stock
  
• Viscosity: 1400 cps @ 350°F
  
• Softening Point: 230°F
  
• Form Chicklet Form
  
• Color: Amber Wafer
  
• Solids: 100% Solids
  
• Package Size: 25 lb Carton
  

Note: Prices shown are sample quantities. Contact us for volume pricing.